Molding Compounds Market Growing At A CAGR Of 6.53% From 2024 To 2033
Molding compounds are composed of a conductive material, a thermoplastic polyvinyl butyral terpolymer binder, and a glycol ether solvent and carbon particle infused into the ink. Due to its good conductive property is widely used in automotive, electronics, displays, switches, and many others.
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